Multi-aperture imaging device having a beam-deflecting device comprising reflecting facets

ABSTRACT

The fact that a beam-deflecting device can be produced cost-effectively and without any losses of optical quality of the multi-aperture imaging device is used when a carrier substrate is provided for the same, wherein the carrier substrate is common to the plurality of optical channels and is installed with a setting angle, i.e. oblique with respect to the image sensor in the multi-aperture imaging device such that a deflection angle of deflecting the optical path of each optical channel is based, on the one hand, on the setting angle and, on the other hand, on an individual inclination angle with respect to the carrier substrate of a reflecting facet of a surface of the beam-deflecting device facing the image sensor, the reflecting facet being allocated to the optical channel.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of copending InternationalApplication No. PCT/EP2016/069630, filed Aug. 18, 2016, which isincorporated herein by reference in its entirety, and additionallyclaims priority from German Application No. 10 2015 215 836.5, filedAug. 19, 2015, which is also incorporated herein by reference in itsentirety.

The present invention relates to a multi-aperture imaging device havinga beam-deflecting device comprising reflecting facets.

BACKGROUND OF THE INVENTION

Multi-aperture imaging devices are in particular used in applicationswhere a single-aperture imaging device would have disadvantages withregard to the installation size. For example, different portions of afield of view of a total field of view are projected on different areasof an image sensor. This takes place via several optical channels,wherein each channel is defined by a respective optic which performsprojecting on the respective area of the image sensor. The optical pathsof the optical channels in the optics can be parallel or almost parallelto one another. A specific installation height that cannot be fallenbelow results in a direction z of a distance of the image sensor to theoptics of the plurality of optical channels. This is in particularnoticeable in single-line arrays of optical channels, since there theextension of the combination of image sensor and optics of the opticalchannels measured in a direction along the optical paths is greater thanthe installation height (y-axis), such that depending on the applicationan installation of image sensor and optical channels would beadvantageous, according to which the total field of view to be actuallycovered is not in front of, but at the side of the combination of imagesensor and optical channels. In that case, it is possible to use abeam-deflecting device for deflecting the optical paths of the opticalchannels. Here, the beam-deflecting device can also be used for changingthe mutual orientation of the optical paths from the parallel or almostparallel course in order to, for example, starting from a single-linearray of the optical channels, cover a total field of viewtwo-dimensionally in partial fields of view, i.e. with one partial fieldof view per optical channel. For this, the beam-deflecting device hasone reflecting facet per optical channel. In particular in the low-costsector it is difficult to produce the facets with, on the one hand,sufficient optical accuracy for preventing image errors and, on theother hand, in a cost-effective manner. Forming a prism of polymer, forexample, which comprises a facet-like chamfered surface is difficultsince the forming process is accompanied by loss. This does not onlyapply to polymers but also to glass. In both cases, losses occur in thetransition from liquid or melt into the solid state. This results againin form deviations between the tool and the molding tool respectively,or the form on the one hand and the molded structure on the other hand,wherein the form deviations are again not acceptable in theabove-mentioned usage in multi-aperture devices.

SUMMARY

According to an embodiment, a multi-aperture imaging device may have: animage sensor; a plurality of optical channels; a beam-deflecting devicefor deflecting optical paths of the plurality of optical channels,wherein the beam-deflecting device comprises a carrier substrate commonfor the plurality of optical channels, wherein a deflection angle ofdeflecting the optical paths of each optical channel is based on asetting angle of the carrier substrate of the beam deflection apparatuswith respect to the image sensor and on an inclination with respect tothe carrier substrate, which varies among the optical channels, of areflecting facet of a surface of the beam deflecting apparatus facingthe image sensor, the reflecting facet being allocated to the opticalchannel.

Another embodiment may have the manufacturing of an inventivemulti-aperture imaging device, wherein the reflecting facets allocatedto the optical channels are generated by: molding additional materialonto the carrier substrate or injection molding or pressing materialsuch that the carrier substrate is formed integrally with the reflectingfacets allocated to the optical channels in the surface facing the imagesensor.

The core idea of the present invention is the finding that that abeam-deflecting device can be produced cost-effectively and without anylosses of optical quality of the multi-aperture imaging device when acarrier substrate is provided for the same, wherein the carriersubstrate is common to the plurality of optical channels and isinstalled with a setting angle, i.e. oblique with respect to the imagesensor in the multi-aperture imaging device such that a deflection angleof deflecting the optical path of each optical channel is based, on theone hand, on the setting angle and, on the other hand, on an individualinclination angle with respect to the carrier substrate of a reflectingfacet of a surface of the beam-deflecting device facing the imagesensor, the reflecting facet being allocated to the optical channel

In that way, the “coarse deflection” of the optical paths of the opticalchannels is obtained via the setting angle. Thus, this portion producesno loss problem in the molding process for producing the beam-deflectingdevice. Rather, it is, for example, possible that the inclination anglesare limited to the mutual angular differences of the beam deflections ofthe optical channels, i.e. are small and result in only a small volumeto be formed or molded.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention will be detailed subsequentlyreferring to the appended drawings, in which:

FIG. 1 is a schematic perspective view of a multi-aperture imagingdevice according to an embodiment;

FIG. 2a is a graph showing the beam-deflection angle α_(x) around thex-axis for the different channels, plotted on a channel index along thehorizontal axis, wherein α_(x) is plotted along the y-axis in arbitraryunits;

FIG. 2b is a respective graph where the deflection angle for the opticalchannels is plotted on the y-axis along the transversal directionperpendicular thereto, namely α_(z), i.e. the angular deflection out ofthe yz-plane;

FIGS. 3a-3d are side views or a top view of a beam-deflecting deviceaccording to an embodiment, wherein FIG. 3a shows a side view where thesubstrate of the beam-deflecting device can be seen in the substrateplane itself, wherein the line extension direction is transversal to theside view, FIG. 3c shows the respective side view from the oppositedirection, FIG. 3b a top view of the reflecting facets perpendicular tothe substrate plane and FIG. 3d a side view of the mirror deflectingdevice laterally along the line extension direction;

FIG. 4a is a schematic side view of the beam-deflecting device with ashown setting angle and channel-individual inclination angles, whereinthe side sectional plane runs perpendicular to the line extensiondirection and wherein the case is illustrated that all facets areinclined such that the lateral face of the substrate closer to the imagesensor and running parallel to the line extension direction is thinnerthan the opposite lateral face facing away from the image sensor;

FIG. 4b is a side view of the beam-deflecting device for an alternativecase to FIG. 4a that the lateral face of the substrate facing the imagesensor is thicker than the lateral face further apart from the imagesensor;

FIG. 4c is a side sectional view of a mirror deflecting device for thecase that both facets according to FIG. 4a as well as facets accordingto FIG. 4b exist;

FIG. 5a is a side sectional view of several mirror deflecting devicesformed in multiple use by molding on a common substrate and that are notyet singulated, wherein the side sectional view is perpendicular to theline extension direction when the later installation of the mirrordeflecting devices into the multi-aperture imaging device is considered,or perpendicular to the longitudinal direction of the mirror deflectingdevices with regard to the state after singulation;

FIG. 5b is a side sectional view according to FIG. 5a , wherein,however, multi-use production by integer forming by means of impressingor injection molding is illustrated, where the impressed or moldedsubstrate is integrally formed and includes the facets on a side facingthe image sensor;

FIG. 6a is the side sectional view of FIG. 5a with shown singulationcutting lines parallel to the line extension direction or longitudinaldirection of the mirror deflecting devices;

FIG. 6b is a side sectional view for the case of FIG. 5b for FIG. 5a ,corresponding to FIG. 6 a;

FIG. 7 is a side sectional view of beam-deflecting devices produced inmulti-use according to FIG. 5a or FIG. 5b , wherein here, exemplarily,the cutting planes for singulation do not run perpendicular to thesubstrate, but oblique to the substrate;

FIG. 8 is a schematic side sectional view of a mirror deflecting deviceaccording to FIG. 4b using the oblique singulation according to FIG. 7for illustrating the advantages of oblique singulation with regard toreducing installation height;

FIG. 9 is a schematic side sectional view of a mirror deflecting device,which is pivoted around an axis of rotation parallel to the lineextension direction in order to be movable between first and secondpositions where the optical paths of the optical channels are deflectedin opposite directions;

FIG. 10 is a schematic perspective view of a multi-aperture imagingdevice according to FIG. 1 with additional means for changing therelative locations of image sensor 12, channel array and mirrordeflecting device to one another;

FIG. 11 is a perspective view of a mobile device for illustrating aninstallation of the multi-aperture imaging device; and

FIG. 12 is a perspective view of a mobile device for illustrating aninstallation of two multi-aperture imaging devices for stereoscopypurposes; and

FIGS. 13a and 13b are a side sectional view and a top view of amulti-aperture imaging device according to a variation of FIG. 1 wherethe optical axes of the channels have a pre-divergence in order to bedivergent in a common plane parallel to the line extension directionsuch that the number of facets having a pairwise differing inclinationcan be reduced.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows an embodiment of a multi-aperture imaging device. Themulti-aperture imaging device 10 of FIG. 1 includes an image sensor 12and a plurality 14 of optical channels, each of which being defined byrespective optics 16 ₁, 16 ₂, 16 ₃ and 16 ₄. Each optical channel 14 ₁,14 ₂, 14 ₃, 14 ₄ projects, by means of the allocated optics 16 ₁-16 ₄, achannel-individual section of a total field of view of themulti-aperture imaging device 10 on a respective image sensor area 12 ₁,12 ₂, 12 ₃ or 12 ₄. The image sensor 12 can, for example, be a chipcomprising pixel arrays in the image sensor areas 12 ₁-12 ₄.Alternatively, the image sensor 12 could comprise one pixel array chipper image sensor area 12 ₁-12 ₄. Again, it would be possible that theimage sensor 12 comprises a pixel array extending continuously acrossthe image sensor areas 12 ₁-12 ₄, i.e. a pixel array having arectangular or varying extension in which the image sensor areas 12 ₁-12₄ lie, wherein in that case, for example, merely the image sensor areas12 ₁-12 ₄ of this common continuous pixel array of the image sensor 12are read out. Different combinations of these alternatives are alsopossible, such as the existence of one chip for two or more channels anda further chip for again different channels or the like. In the case ofseveral chips of the image sensor 12 the same can be mounted, forexample on one or several boards, such as all of them together or ingroups or the like.

The optics 16 ₁-16 ₄ consist, for example, each of a lens or a group oflenses which can be held as shown in FIG. 1 by a common holder 18.Exemplarily, the holder 18 is formed of transparent material and ispenetrated by the optical paths of the optical channels but there arealso other alternatives for holders.

Advantageously, the image sensor areas 12 ₁-12 ₄ are disposed in acommon plane, namely the image plane of the optical channels 14. In FIG.1, this plane is shown exemplarily parallel to the plane spanned by anx- and an y-axis of a Cartesian coordinate system shown in FIG. 1 forsimplifying the following description and provided with reference number20.

In a plane parallel to the image sensor 12, i.e. parallel to thexy-plane, for example, optics 16 ₁-16 ₄ are also disposed next to oneanother. In the example of FIG. 1, the relative positions of the imagesensor areas 12 ₁-12 ₄ in the image sensor plane are additionallypositioned congruently to the relative positions of the optics 16 ₁-16 ₄and the optics 16 ₁-16 ₄ along the x- and y-axis, i.e. lateral inrelation to the image sensor 12 such that optical centers of the optics16 ₁-16 ₄ are centered with respect to the centers of the image sensorareas 12 ₁-12 ₄. This means that in the example of FIG. 1 optical axes22 ₁-22 ₄ of the optical channels 14 ₁-14 ₄ run parallel to one anotherand parallel to the z-axis of the coordinate system 20 in relation towhich optical axes the image sensor areas 12 ₁-12 ₄ and the optics 16₁-16 ₄ are centered. It should be noted that there are also alternativeswith respect to the above described arrangement of image sensor areas 12₁-12 ₄ and optics 16 ₁-16 ₄. For example, a slight divergence of theoptical axes 22 ₁-22 ₄ would also be possible. Further, it is possiblethat the multi-aperture imaging device includes one or several meansthat are able to change a relative location of the optics 16 ₁-16 ₄ withrespect to the image sensor areas 12 ₁-12 ₄ in lateral direction, i.e.in x- and/or y-direction such as for image stabilization. In thisrespect, reference is made to FIG. 10.

The optics 16 ₁-16 ₄ project objects in a scene with an overall or totalfield of view of the multi-aperture imaging device 10 on the allocatedimage sensor areas 12 ₁-12 ₄ and for this the same are positioned at arespective interval or a respective distance from the image sensor 12.While this distance might also be fixed, the multi-aperture imagingdevice could alternatively have a means for changing this imagesensor-to-optics distance, such as for manual or automatic change offocus.

In FIG. 1, the plurality 14 of optical channels 14 ₁-14 ₄ is formed assingle-line array. In the case of FIG. 1, the optical channels 14 ₁-14 ₄are disposed beside one another along the x-axis. Thus, the x-axiscorresponds to the line extension direction of the array 14. The imagesensor areas 12 ₁-12 ₄ are also disposed next to one another along thisdirection. In FIG. 1, the number of optical channels is exemplarilyfour, but a different number greater than or equal to two would also bepossible. In the case of a linear array of optical channels asillustrated in FIG. 1, the size extension of the multi-aperture imagingdevice 10, as limited towards the bottom by the image sensor 12 and theoptics 16, is greatest along the line extension direction. The minimumextension of the multi-aperture imaging device 10 as determined by themutual arrangement of image sensor 12 to optics 16 along the z-axis,i.e. along the optical axes or optical paths of the optical channels 14₁-14 ₄, is smaller than the minimum extension along the x-axis but, dueto the implementation of the optical channels 14 ₁-14 ₄ as single-linearray, the same is greater than the minimum extension of themulti-aperture imaging device in the lateral direction y perpendicularto the line extension direction x. The latter is given by the lateralextension of each individual optical channel 14 ₁-14 ₄, such as theextension of the optics 16 ₁-16 ₄ along the x-axis, possibly includingthe holder 18. In this situation, depending on the application, such asfor example the installation of the multi-aperture imaging device intothe housing of a portable device, such as a mobile phone or the same,where the housing is very flat, it can be desirable to align imagesensor 12 and optics 16 ₁-16 ₄ such that the fields of view of theoptical channels without beam deflection actually look into directionsdeviating from an actually desired field of view direction of themulti-aperture imaging device 10. For example, it could be desirable toinstall the multi-aperture imaging device 10 such that image sensor 12and optics 16 ₁-16 ₄ are aligned perpendicular to the greatest sides orthe main sides of the flat housing, i.e. the optical axis 22 ₁-22 ₄between image sensor 12 and optics 16 ₁-16 ₄ are parallel to these mainsides, while the scene to be captured is in a direction perpendicularthereto, i.e. in front of the one main side which is for example thefront side, and, for example, comprises a screen or in front of theother main side which is, for example, the rear of the housing.

For that reason, the multi-aperture imaging device 10 includes abeam-deflecting device deflecting the optical paths or the optical axes22 ₁-22 ₄ of the plurality of optical channels 14, such that the totalfield of view of the multi-aperture imaging device 10, seen from themulti-aperture imaging device 10, is not in the direction of the z-axisbut elsewhere. FIG. 1 presents the exemplary case that the total fieldof view of the multi-aperture imaging device 10 after deflection isessentially along the y-axis, i.e. deflection essentially takes place inthe zy-plane.

Before a further function of the beam-deflecting device 24 will bediscussed, it should be noted that the explanations concerning thesingle-line character of the array 14 of optical channels is not to beseen in a limiting manner and that embodiments of the presentapplication also include implementations where the plurality of opticalchannels are arranged in a two-dimensional array. For example, fromdifferent points of view than the ones discussed above, it could bedesirable to perform reorientation of the total field of view of themulti-aperture imaging device 10 relative to the combination of imagesensor 12 and optics 16 ₁-16 ₄. Such points of view could concern, forexample, also the additional function of the beam-deflecting device 24described below.

As described above, in the embodiment of FIG. 1, the optical axes 22₁-22 ₄ are parallel to one another prior to or without deflection by thebeam-deflecting device 24, or, for example at the optics 16 ₁-16 ₄, asshown in FIG. 1, or only deviate slightly therefrom. The correspondingcentered positioning of optics 16 ₁-16 ₄ as well as the image sensorareas 12 ₁-12 ₄ is easy to produce and favorable with regard tominimizing installation space. Parallelism of the optical paths of theoptical channels also has the effect that the partial fields of viewthat are covered by the individual channels 14 ₁-14 _(N) or projected onthe respective image sensor areas 12 ₁-12 ₄ would completely overlapwithout any further measures, namely beam deflection. In order to covera greater total field of view by the multi-aperture imaging device 10,it is a further function of the beam-deflecting device 24 of FIG. 1 toprovide the optical paths with divergence such that the partial fieldsof view of the channels 14 ₁-14 _(N) overlap less with one another.

For example, it is assumed that the optical axes 22 ₁-22 ₄ of theoptical paths of the optical channels 14 ₁-14 ₄ are parallel to oneanother before or without the beam-deflecting device 24 or deviate withrespect to a parallel orientation along the orientation averaged acrossall channels by less than one tenth of a minimum aperture angle of thepartial fields of view of the optical channels 14 ₁-14 _(N). Without anyadditional measures, the partial fields of view will mostly overlap.Therefore, the beam-deflecting device 24 of FIG. 1 includes, for eachoptical channel 14 ₁-14 _(N), a reflecting facet 26 ₁-26 ₄ clearlyallocated to that channel, which are each optically planar and inclinedto one another, namely such that the partial fields of view of theoptical channels overlap less as regards to a spatial angle and cover,for example, a total field of view having an aperture angle which is,for example, greater than 1.5 times the aperture angle of the individualpartial fields of view of the optical channels 14 ₁-14 _(N). In theexemplary case of FIG. 1, the mutual inclination of the reflectingfacets 26 ₁-26 ₄ has the effect, for example, that the optical channels14 ₁-14 _(N) actually disposed linearly next to one another along thex-axis cover the total field of view 28 according to a two-dimensionalarrangement of the partial fields of view 30 ₁-30 ₄.

If, in the embodiment of FIG. 1, the angular deflection of optical axes22 ₁-22 ₄ of the optical channel 14 ₁-14 ₄ is considered in the planespanned or defined by the averaged direction of the optical axis priorto beam deflection and the averaged direction of the optical axis afterbeam deflection, i.e., in the xy-plane in the example of FIG. 1 on theone hand and in the plane running perpendicular to the latter plane andparallel to the averaged direction of the optical axis after beamdeflection, the behavior shown in FIG. 2a and FIG. 2b results. FIG. 2ashows the beam deflection α_(x) in the first plane and FIG. 2b shows thebeam deflection in the latter plane, namely α_(z). FIGS. 2a and 2billustrate the case that the average beam deflection of the optical axesis such that the average direction after beam deflection corresponds tothe y-axis. On average, the optical axes of the optical channels aredeflected by 90° in the yz-plane around the x-axis and, on average, theoptical axes are not tilted out of the yz-plane.

As indicated by dotted lines in FIG. 1 at 32, an essentiallyprism-shaped body could be formed as beam-deflecting device, but thiswould be accompanied by the disadvantages already indicated in theintroductory part of the description of the present application: theloss occurring during molding depends on the amount of material of thematerial to be formed and, hence, molding a body as indicated by 32would be accompanied by difficulties that increase the production costsor result in a lower quality of the optical projections of the opticalchannels 14 ₁-14 _(N).

For the latter reason, as illustrated in more detail below, thebeam-deflecting device 24 of FIG. 1 is produced such that the samecomprises a common carrier substrate 34 which the plurality 14 ofoptical channels have in common, i.e., which extends across all opticalchannels. The carrier substrate 34 is placed in a tilted manner with thesetting angle with respect to the image sensor 12, namely around theaxis around which the average direction of the optical axes of theoptical channels is deflected, i.e., the x-axis in FIG. 1. This settingangle has the effect that the surface of the beam-deflecting device 24facing the image sensor already effects “coarse deflection” of theoptical paths of the optical channels.

If α_(x) ^(min) is, for example, the minimum beam deflection of theoptical axes 16 ₁-16 ₄ of the optical channels 14 ₁-14 ₄ around thex-axis, i.e., α_(x) ^(min)=min{α_(x) ^(i)} with α_(x) ^(i) equal to thebeam deflection of the optical channel 14 _(i) with α_(x) ^(i)=0,meaning that no beam deflection occurs, then the carrier substrate 24can be inclined with respect to the image sensor 12 such that 90°−α_(x)⁰≤½·α_(x) ^(min) applies, wherein α_(x) ⁰ is greater than 0° and lessthan 90° and α_(x) ⁰=0° is to correspond the plane-parallel orientationof the carrier substrate 34 to the image sensor 12. This case will bediscussed below with reference to FIG. 4a . As can be seen, in thiscase, the reflecting facets 26 ₁₋₄ are not inclined in the yz-plane withrespect to the substrate or only in the direction, such that the lateralface of the substrate closer to the image sensor is narrower than theone pointing in the opposite direction. When equality applies, i.e.,90°−α_(x) ⁰=½·α_(x) ^(min), at least one facet exists which is notinclined with respect to the substrate in the yz-plane.

α_(x) ^(max) may be, for example, the maximum beam deflection of theoptical axes 16 ₁-16 ₄ of the optical channels 14 ₁-14 ₄ around thex-axis, i.e., α_(x) ^(mx)=mx{α_(x) ^(i)}. Then, for example, the carriersubstrate 24 could also be inclined with respect to the image sensor 12such that 90°−α_(x) ⁰≥½·α_(x) ^(max) applies. This case will bediscussed below with reference to FIG. 4b . As can be seen there, inthis case, the reflecting facets 26 ₁₋₄ are not inclined in the yz-planewith respect to the substrate or only in the direction, such that thelateral face of the substrate closer to the image sensor is wider thanthe one pointing in the opposite direction. If equality applies, i.e.,90°−α_(x) ⁰=½·α_(x) ^(max) at least one facet exists which is notinclined with respect to the substrate in the yz-plane.

In the described manner, it is possible that the beam-deflecting device24 comprises, beyond a purely parallelepiped shape, additional material(in addition to the pure parallelepiped shape) merely on the side facingthe image sensor 12 in order to form the mutual inclinations of thereflecting facets 26 ₁-26 ₄. These inclination angles are, however, muchsmaller than the total deflection angles α_(x) ^(i), since the same aremerely to perform the residual deflections of the optical paths. For theinclination angles β^(i) _(x) in the y z-plane, namely the residualdeflection around the x-axis, β^(i) _(x)=|½(α^(i) _(x)−2(90°−α_(x) ⁰))|applies. The inclination angles in the yz-plane correspond to the halvesof the finer channel-individual deflections. In the other transversaldirection concerning the beam deflection out of the YZ-plane, thedeflection angles α^(i) _(z) and hence also the inclination angles β^(i)_(z) of the facets out of the substrate plane along the x-axis are smallanyway.

For the deflection angles of deflecting the optical path of each opticalchannel by the beam-deflecting device 24, this means that the same areeach based on the setting angle α_(x) ⁰ as well as the respectiveinclination of the reflecting facet allocated to the optical channelwith respect to the carrier substrate 34 itself. These mentionedface-individual inclinations of the facets 26 ₁-26 ₄ can be described,as stated above, by an inclination angle in the yz-plane and aninclination angle with respect to the normal of the carrier substrate 3in the plane perpendicular thereto. It is advantageous, when it applies,that for each channel the setting angle α_(x) ⁰ is greater than theinclination, i.e., α_(x) ⁰>max(|β_(x)|, |β_(z)|) for all channels. It iseven more advantageous when said inequality is fulfilled already forα_(x) ⁰/2 or even for α_(x) ⁰/3. In other words, it is advantageous whenthe setting angle is great compared to the inclination angles of thefacets is 26 ₁-26 _(N), such that additional material with respect to apure parallelepiped shape of the beam-deflecting device 24 is low. α_(x)⁰ can be, for example, between 30° and 60°, each inclusively.

FIGS. 3a-3d shows side views of a beam-deflecting device according to anembodiment for an example of 4 optical channels that are arrangedlinearly or on one side as illustrated exemplarily in FIG. 1. Thebeam-deflecting device 24 of FIG. 3a-3d could be used as beam-deflectingdevice of FIG. 1, wherein then the partial fields of view would notcover the total field of view in clockwise direction 3, 4, 2, 1 asillustrated in FIG. 1, but in clockwise direction according to the order4, 2, 1, 3. The inclination angles of facets 26 ₁-26 ₄ are shown inFIGS. 3a-3d . The same are distinguished from one another or areallocated to the respective channel by superscript indices 1 to 4. Here,both β_(x) ¹ and β_(x) ⁴ are 0°. The rear side of the carrier substrate,i.e. the side opposing the surface provided with facets 26 ₁-26 ₄ isindicated by 36 in FIGS. 3a-3d . The material forming theparallelepiped-shaped portion of the carrier substrate 34 is below thedotted line 38. It can be seen that the additional material which willbe added to the same has little volume, such that molding is madeeasier.

The production of the beam-deflecting device 24 of FIGS. 3a-3d can, forexample, be performed in that the additional material is molded onto thecarrier substrate 34 by a molding tool. Here, the carrier substrate 34could be glass while the molded additional material thereon is polymer.A further option would be forming the beam-deflecting device 24 of FIGS.3a-3d integrally by injection molding or the same.

In the above described statements, it has already been described that,as indicated in FIG. 4a , the inclination angles of the facets 26 _(i)of the channels 14 _(i) can be inclined around the x axis or in the yzplane in the same direction, namely by the setting angle α_(x) ⁰ of thecarrier substrate 34 of the beam-deflecting device 24 relative to theimage sensor 12, such that it applies for all facets 26 _(i) of allchannels that the thickness of the beam-deflecting device 24 on the side40 further apart from the image sensor 12 is greater than on the side 42closer to the image sensor. There are, however, alternatives to thiswhich are illustrated in FIGS. 4b and 4c . According to FIG. 4b , theabove stated circumstance is reversed. This means the inclination anglesof facets 26 _(i) in the yz plane, i.e. the inclinations β_(x) ^(i) aresuch that it applies for all facets 26 _(i) that the beam-deflectingdevice 24 has a side 42 facing the image sensor where the same isthicker than on the side 40 facing away from the image sensor. Thus,FIG. 4b applies with reference to FIG. 2a and FIG. 2 b: 90°−α_(x)⁰≥½·α_(x) ^(max). According to FIG. 4c it is possible that both casesoccur; i.e. a facet 26 _(i) is inclined according to FIG. 4a and a facet26 _(j) is inclined according to FIG. 4b . Thus, ½·α_(x)^(max)≤90°−α_(x) ⁰≤½·α_(x) ^(min) applies.

Thus, the embodiment of FIG. 1 with the deflecting device of FIG. 3represents a multi-aperture imaging device where each channel defines aprojection on an image sensor area 12 _(i) and includes an allocatedimaging optics 16 _(i) and is deflected by an allocated segment or afacet 16 _(i) of the beam-deflecting device 14. The facets 26 _(i)represent portions of the surface or side of the beam-deflecting device24 facing the image sensor 12. The same can be produced by means ofmolding of a polymer, such as a UV-curable polymer on a common planarsubstrate 34 such as glass, polymer, metal, silicon or other suitablematerials. The body consisting of the planar substrate 34 and the prismsmolded thereon, namely one for each channel 14 _(i), wherein the bodyforms the deflecting device 24, can be aligned with the optical axis 22_(i) of the imaging channels 14 _(i) such that the surface normal of thesubstrate 34, i.e. the normal on the parallelepiped-shaped portion ofthe beam-deflecting device 24 takes up an angle >0 and <90° to theoptical axis 22 _(i), which is advantageously approximately 45° or liesbetween 30° and 60°, each inclusively.

According to an embodiment, a plurality of deflecting devices 24 areproduced simultaneously on a substrate by means of replicationprocesses. An embodiment will follow. For providing the facets 26 _(i)with reflectivity, either a reflecting material can be molded or thefront sides of facets 26 _(i) can be provided with mirroring. Themirrors can include both metallic and dielectric layers.

Again, in other words, deflecting devices according to FIG. 3 can beproduced in multi-use. Here, the deflecting devices as indicated in FIG.5a can be produced by means of molding, for example polymer, on a planarsubstrate or production is performed by means of casting or impressingglass or polymer, such that a single-component entity results asindicated in FIG. 5b . The individual deflecting devices can then besingulated subsequently by sawing, laser, sand or water jet cutting. Theseparation could obviously be performed by means of sawing cuts 43perpendicular to the carrier substrate 34 or perpendicular to the rearside 38 of the same. However, advantageously, the separation can also beperformed such that the cutting surfaces result by the singulation cuts,taking up an angle≠0 with the area normals of the carrier substrate 34.Perpendicular cuts are illustrated in FIG. 6a for the case of moldingpolymer on a carrier substrate and in FIG. 6b for the case of impressinga material with subsequent perpendicular cuts and FIG. 7 showsexemplarily for the case of molding polymer on a planar carriersubstrate the singulation along oblique cutting surfaces 43, i.e. alongcutting surfaces that are angular to the area normal of the carriersubstrate.

FIG. 8 illustrates the reason for this: the cutting angle of thesingulation cutting planes placed between adjacent deflecting devicesrunning parallel to the line extension direction can be selected suchthat when installing the same into the multi-aperture imaging device 10,these cutting surfaces run parallel or almost parallel to the opticalaxes 22 _(i) of the optical channels 14 _(i) prior to or without beamdeflection, such that, all in all, a minimum installation height of theoverall system of the multi-aperture imaging device 10 results. FIG. 8illustrates the minimum installation height resulting therefrom, as anillustration for the case of FIG. 4b where for each channel i the facetsin the yz plane, i.e. in the plane, where the setting angle is greatest,are inclined such that the side 40 furthest apart from the image sensor12 of the carrier substrate 34, which runs perpendicular to the abovementioned plane, i.e. parallel to the line extension direction of theimage sensor 12, is not or less enlarged with respect to theparallelepiped shape of the carrier substrate 34 in thickness directionof the carrier substrate 34 by the additional material for forming thefacets 26 _(i). As shown in FIG. 8, these sides 40 and 42 run parallelto part of the optical path or the optical axis 22 _(i) on the imagesensor side. Advantageously, in the configuration of FIG. 4b , thesingulation planes indicated by lines 43 in FIGS. 6a, 6b and 7 do notintersect the additional material forming the facets. In theconfiguration of FIG. 4a , this would not be the case for all thefacets, and in the configuration of FIG. 4c for those facetscorresponding to the configuration of FIG. 4a . However, as shown by acomparison between FIG. 4b and FIG. 8, the installation height in the ydirection is not reduced in the case of FIG. 8 with respect to the caseof FIG. 4b . For the angle γ between the side 40 and the rear side 36 inthe yz-plane, the following applies 0.9·(90°−α_(x) ⁰)≤γ≤1.1·(90°−α_(x)⁰).

FIG. 9 illustrates exemplarily for the case of FIG. 4a that in symmetryto the rear side 36, the beam-deflecting device could comprise anequally formed substrate 34′ in addition to the substrate 34. By pivotedsuspension of the beam-deflecting device 24 around an axis 48 runningalong the line extension direction or along the x axis, thebeam-deflecting device 24 could be changed from a position I with theabove-described setting angle to a position II with a setting anglecorresponding to an opposite inclination with respect to the imagesensor 12 and hence has the effect that in the position I the facets 26_(i)′ effect the above-mentioned beam deflection, while in the positionII the facets 26 _(i) effect a beam deflection in an essentiallyopposite direction as indicated in FIG. 9 by 22 _(i) or 22 _(i)′.Obviously, it would also be possible to apply this reversibility byrotation around the axis 48 also in configurations according to FIG. 4bor FIG. 4c . For production, for example, the rear sides 36 of the twosubstrates 34 and 34′ could be connected to one another, such as byadhesive bonding or another joining process.

Above, it has already been mentioned that the optical paths or opticalaxes could deviate from a parallelism prior to or without beamdeflection. This circumstance will be described below by the fact thatthe channels could be provided with some sort of pre-divergence. Withthis pre-divergence of the optical axes 22 ₁-22 ₄ it would be possiblethat, for example, not all facet inclinations are different but thatsome groups of channels have, for example, the facets of the sameinclination. The latter could then be formed integrally or continuouslymerging with one another, virtually as one facet allocated to this groupof channels adjacent in line extension direction. The divergence of theoptical axes of these channels could then originate from the divergenceof these optical axes as obtained by lateral offset between opticalcenters of the optics and image sensor areas of the channels. Thepre-divergence could be limited, for example, to one plane. Prior to orwithout beam deflection, the optical axes could run, for example, in acommon plane but divergent within the same and the facets effect merelyan additional divergence in the other transversal plane, i.e. they areall inclined parallel to the line extension direction (β^(i) _(z)=0 forall i) and with respect to one another only differing from theabove-mentioned common plane of the optical axes, wherein again severalfacets can have the same inclination or can be allocated together to agroup of channels whose optical axes differ, for example, already in theabove-mentioned common plane of the optical axes pairwise prior to, orwithout, beam deflection.

The above mentioned, possibly existing, pre-divergence can be obtained,for example, by arranging the optical centers of the optics on astraight line along the line extension direction while the centers ofthe image sensor areas are arranged in a manner deviating from theprojection of the optical centers along the normal of the plane of theimage sensor areas at points of a straight line in the image sensorplane, such as at points deviating from the points on the abovementioned straight line in the image sensor plane in achannel-individual manner along the line extension direction and/oralong the direction perpendicular to both the line extension directionand the image sensor normal. Alternatively, pre-divergence can beobtained, in that the centers of the image sensors are on a straightline along the line extension direction, while the centers of the opticsfrom the projection of the optical centers of the image sensors arearranged in a manner deviating along the normal of the plane of theoptical centers of the optics on points of the straight line in theoptic center plane, such as at points that deviate from the points onthe above-mentioned straight line in the optic center plane in achannel-individual manner along the line extension direction and/oralong the direction perpendicular to both the line extension directionand the normal of the optic center plane. It is advantageous when theabove-mentioned channel-individual deviation from the respectiveprojection runs merely in line extension direction, i.e. the opticalaxes that are in a common plane are provided with pre-divergence. Then,both optical centers and image sensor area centers are on a straightline in parallel to the line extension direction but with differentintermediate distances. In contrast, a lateral offset between lenses andimage sensors in perpendicular direction lateral to the line extensiondirection would result in an enlargement of the installation height. Anoffset merely within the plane in line extension direction does notchange the installation height but possibly less facets will resultand/or the facets will have only a tilting in an angular orientationwhich simplifies the structure. This is illustrated in FIGS. 13a and 13bwhere the adjacent channels 14 ₁ and 14 ₂ on the one hand and theadjacent channels 14 ₃ and 14 ₄ on the other hand have optical axes 14 ₁and 14 ₂ or 14 ₃ and 14 ₄ running in a common plane and squinting withrespect to one another i.e. provided with pre-divergence. Facets 26 ₁and 26 ₂ can be formed by one facet and facets 26 ₃ and 26 ₄ can beformed by another facet as indicated by dotted lines between therespective pairs of facets and the only two facets are merely inclinedin one direction and both in parallel to the line extension direction,i.e. (β^(i) _(z)=0 and β^(i) _(x)≠0 for all i and β¹ _(x)=β² _(x) and β³_(x)=β⁴ _(x)).

Further, it could be intended that some optical channels are allocatedto the same partial field of view, such as for the purpose ofsuper-resolution or for increasing the resolution by which therespective partial field of view is sampled by these channels. Then, theoptical channels within such a group would run parallel prior to beamdeflection and would be deflected by a facet onto a partial field ofview. Advantageously, pixel images of the image sensor of a channel of agroup would lie in intermediate positions between images of the pixelsof the image sensor of another channel of this group.

An implementation where a group of immediately adjacent channels in lineextension direction completely cover the total field of view with theirpartial fields of view and where a further group of immediately adjacentchannels on their part also completely cover the total field of viewwould also be possible, for example not for super-resolution purposes,but merely for stereoscopy purposes.

FIG. 10 shows that the multi-aperture imaging device 10 of FIG. 1 couldadditionally include a means 50 for effecting rotation of thebeam-deflecting device 24 around an axis parallel to the line extensiondirection or x-axis. The axis of rotation is, for example, within theplane of optical axes 22 ₁-22 ₄ or by less than a quarter of a diameterof the optics 16 ₁-16 ₄ apart therefrom. Alternatively, it will also bepossible that the axis of rotation is further apart, such as less thanone optics diameter or less than four optics diameters. This means 50could, for example, be part of an image stabilization control of thedevice 10 by compensating blurs around the x-axis by adaptively changingthe setting angle and/or for shifting the beam-deflecting device 24between positions I and II mentioned with reference to FIG. 9.

Further, the multi-aperture imaging device 10 of FIG. 10 canadditionally or alternatively include means 52 effecting translatorymovement of the optics 16 _(i) along the x-axis. The means 52 can alsobe part of an image stabilization and can effect, for example, blurs ina direction perpendicular to the above mentioned blur compensation viameans 50.

Additionally or alternatively, the device 10 can further include means54 adjusting, for focus adjustment, a distance between image sensor 12and optics 16 along the optical axes 22 _(i). The means 54 can becontrolled by autofocus control or also manually by the user of thedevice in which the device 10 is installed.

Thus, means 52 serves as suspension of the optics and advantageously, asindicated in FIG. 4, the same is disposed laterally next to the samealong the line extension direction in order to not increase theinstallation height. It applies also to means 50 and 54 that the sameare advantageously disposed within the plane of the optical paths inorder to not increase the installation height.

It should be noted that optics 16 ₁-16 ₄ could be held not only amongone another, such as via the already mentioned transparent substrate,but also relative to the beam-deflecting device in a constant relativelocation, such as via a suitable frame which advantageously does notincrease the installation height and hence runs advantageously in theplane of components 12, 14 and 24 or in the plane of the optical paths.The consistency of the relative location could be limited to thedistance between optics and beam-deflecting device along the opticalaxes, such that means 54 moves, for example, the optics 16 ₁-16 ₄together with the beam-deflecting device in a translatory manner alongthe optical axes. The optics-to-beam-deflecting device distance could beset to a minimum distance such that the optical path of the channels isnot laterally limited by the segments of the beam-deflecting device 24,which reduces the installation height, since otherwise the segments 26_(i) would have to be dimensioned for the greatestoptics-to-beam-deflecting device distance with respect to the lateralextension in order to not restrict the optical path. Additionally, theconsistency of the relative location of above mentioned frames couldhold the optics and beam-deflecting device along the x-axis in a rigidmanner to one another, such that means 52 would move the optics 16 ₁-16₄ together with the beam-deflecting device in a translatory manner alongthe line extension direction.

The above-described beam-deflecting device 24 for deflecting the opticalpath of the optical channels allows, together with the actuator 50 forgenerating the rotary movement of the beam-deflecting device 24 of anoptical image stabilization control of the multi-aperture imagingdevice, image or total field of view stabilization in two dimensions,namely by the translatory movement of the substrate 18 imagestabilization along a first image axis running essentially parallel tothe beam-deflecting device, and by generating the rotary movement of thebeam-deflecting means 24 image stabilization along a second image axisrunning essentially parallel to the optical axis prior to or withoutbeam deflection, or if the deflected optical axes are considered,perpendicular to the optical axes and the line extension direction.Additionally, the described arrangement can effect translatory movementof the beam-deflecting device fixed in the above stated frame and thearray 14 perpendicular to the line extension direction, for example bythe described actuator 54, which can be used for realizing focusadjustment and hence for implementing an autofocus function.

For the sake of completeness, it should be noted with respect to theabove statements that the device, when capturing via the image sensorareas, captures one image of a scene per channel, which have beenprojected by the channels on the image sensor areas and that the devicecan optionally have a processor which combines or merges the images toan overall image that corresponds to the scene in the total field ofview and/or provides additional data, such as 3D image data and depthinformation of the object scene for producing depth maps and forsoftware realization, such as refocusing (determining the imagedefinition areas after the actual capturing), All-in-Focus images,Virtual Green Screen (separation of foreground and background), etc. Thelatter tasks could also be performed by that processor or alsoexternally. However, the processor could also represent a componentexternal to the multi-aperture device.

Regarding the above statements, it should still be noted that the facets26 _(i) could be mirrored. Alternatively, it would be possible to formthe additional material in addition to the parallelepiped-shaped portionof the carrier substrate of mirroring material such that separatemirroring could be omitted.

FIG. 11 illustrates that devices 10 of the above described alternativescan be incorporated, for example, in a flat housing of a portable device200, such as a mobile phone or media player or the same, wherein then,for example, the planes of the image sensor 12 or the image sensor areasand the lens planes of the optics of the channels 14 are alignedperpendicularly to the flat extension direction of the flat housing orin parallel to the thickness direction. In that way, for example, thebeam-deflecting device 24 would have the effect that the total field ofview of the multi-aperture imaging device 10 is in front of a front side202 of the flat housing that comprises also a monitor, for example.Alternatively, deflection would also be possible such that the field ofview is in front of a rear side of the flat housing opposing the frontside 202. The housing could comprise a transparent window in thepenetrated side 202 in order to let the optical paths of the opticalchannels 14 pass. Further, switchable diaphragms (mechanically moved,electrochromic) could be attached in order to influence light entrythrough the opening of the window on the front and/or the rear side. Thehousing of the device 200 or the device itself can be flat, since due tothe illustrated location of the device 10 in the housing, theinstallation height of the device 10, which is parallel to the thicknessof the housing, can be kept low. Switchability could also be provided inthat a window is provided on a side opposing the side 202 and, forexample, the beam-deflecting device is moved between two positions byconfiguring the latter, for example, as a mirror mirroring on the frontand on the rear as shown in FIG. 9, and wherein one of them is rotatedto the other position, or as a facet mirror having a set of facets forone position and a different set of facets for the other position,wherein the sets of facets are next to one another in line extensiondirection and switching between the positions is performed by moving thebeam-deflecting device back and forth along the line extension directionin a translatory manner. Installation of the device 10 into another,possibly non-portable device, such as a car, would also be possible.FIG. 12 shows that several modules 10 whose partial fields of view oftheir channels completely and optionally even congruently cover the samefield of view can be installed in the device 200, for example with abase distance B to one another along a line extension direction which isthe same for both modules, such as for the purpose of stereoscopy. Morethan two modules would also be possible. The line extension direction ofmodules 10 could also be non-collinear, but merely parallel to oneanother. However, it should still be mentioned that, as stated above, adevice 10 or a module could be provided with channels such that the samecompletely cover the same total field of view in groups.

Thus, the above embodiments could be implemented in the form of amulti-aperture imaging device having a single-line channel arrangement,wherein each channel transmits a partial field of view of a total fieldof view and the partial fields of view overlap partly. A structurehaving several of such multi-aperture imaging devices for stereo, trio,quatro, etc. structures for 3D image capturing is possible. Theplurality of modules can here be configured as continuous line. Thecontinuous line could use identical actuators and a commonbeam-deflecting element. One or several amplifying substrates possiblyexisting within the optical path could extend across the entire linewhich can form a stereo, trio, quatro structure. Methods forsuper-resolution can be used, wherein several channels project the samepartial image areas. The optical axes can be divergent, even without anybeam-deflecting device, such that less facets are necessitated on thebeam-deflecting unit. Advantageously, the facets then have only anangular component. The image sensor can be a one-piece unit and can haveonly one contiguous pixel matrix or several discontinuous ones. Theimage sensor can be combined of several partial sensors which aredisposed, for example, next to one another on a printed circuit board.An autofocus drive can be configured such that the beam deflectionelement is moved synchronously with the optics or is stationary.

While this invention has been described in terms of several advantageousembodiments, there are alterations, permutations, and equivalents whichfall within the scope of this invention. It should also be noted thatthere are many alternative ways of implementing the methods andcompositions of the present invention. It is therefore intended that thefollowing appended claims be interpreted as including all suchalterations, permutations, and equivalents as fall within the truespirit and scope of the present invention.

The invention claimed is:
 1. A multi-aperture imaging device,comprising: an image sensor; a plurality of optical channels; abeam-deflecting device for deflecting optical paths of the plurality ofoptical channels, wherein the beam-deflecting device comprises a carriersubstrate common for the plurality of optical channels, wherein adeflection angle of deflecting the optical paths of each optical channelis based on a setting angle of the carrier substrate of thebeam-deflecting device with respect to the image sensor and on aninclination with respect to the carrier substrate, which varies amongthe optical channels, of a reflecting facet of a surface of thebeam-deflecting device facing the image sensor, the reflecting facetbeing allocated to the optical channel; and wherein the carriersubstrate comprises a rear side facing away from the image sensor aswell as two lateral faces parallel to a line extension direction and toone another, which connect the surface facing the image sensor and therear side, wherein an angle γ between the rear side and one of thelateral faces further apart from the image sensor fulfills the conditionthat 0.9−(90°−α_(x) ⁰)<=γ<=1.1 (90°−α_(x) ⁰), wherein α_(x) ⁰ is thesetting angle.
 2. The multi-aperture imaging device according to claim1, wherein, for each channel, the setting angle is greater than aninclination angle of the inclination of the reflecting facet allocatedto this channel with respect to the carrier substrate.
 3. Themulti-aperture imaging device according to claim 1, wherein theplurality of optical channels is adapted to detect a total field of viewand forms a single-line array.
 4. The multi-aperture imaging deviceaccording to claim 3, wherein the carrier substrate is positionedparallel to the line extension direction and the setting angle is in aplane perpendicular to the line extension direction.
 5. Themulti-aperture imaging device according to claim 1, wherein a surface ofthe beam-deflecting device facing the image sensor is mirrored at leaston the reflecting facets allocated to the optical channels.
 6. Themulti-aperture imaging device according to claim 1, wherein the carriersubstrate is parallelepiped-shaped and the reflecting facets allocatedto the optical channels are formed by a material molded on theparallelepiped-shaped carrier substrate.
 7. The multi-aperture imagingdevice according to claim 1, wherein the carrier substrate is integrallyformed with the reflecting facets allocated to the optical channels inthe surface facing the image sensor.
 8. The multi-aperture imagingdevice according to claim 1, further comprising a third actuator formoving optics of the plurality of optical channels along the opticalpaths of the plurality of optical channels in a translatory manner. 9.The multi-aperture imaging device according to claim 8, wherein thethird actuator is controlled by a focus control of the multi-apertureimaging device.
 10. Manufacturing of the multi-aperture imaging deviceaccording to claim 1, wherein the reflecting facets allocated to theoptical channels are generated by: molding additional material onto thecarrier substrate or injection molding or pressing material such thatthe carrier substrate is formed integrally with the reflecting facetsallocated to the optical channels in the surface facing the imagesensor.
 11. A multi-aperture imaging device, comprising: an imagesensor; a plurality of optical channels; a beam-deflecting device fordeflecting optical paths of the plurality of optical channels, whereinthe beam-deflecting device comprises a carrier substrate common for theplurality of optical channels, wherein a deflection angle of deflectingthe optical paths of each optical channel is based on a setting angle ofthe carrier substrate of the beam-deflecting device with respect to theimage sensor and on an inclination with respect to the carriersubstrate, which varies among the optical channels, of a reflectingfacet of a surface of the beam-deflecting device facing the imagesensor, the reflecting facet being allocated to the optical channel;wherein the plurality of optical channels is adapted to detect a totalfield of view and forms a single-line array and the carrier substrate ispivoted around an axis of rotation which is parallel to a line extensiondirection of the single-line array; wherein the multi-aperture imagingdevices further comprises a first actuator for generating a rotarymovement of the beam-deflecting device around the axis of rotation;wherein the first actuator is controlled by an optical imagestabilization control of the multi-aperture imaging device such thatimage stabilization is effected by generating the rotary movement of thebeam-deflecting device; and wherein the multi-aperture imaging devicefurther comprises a second actuator for moving optics of the pluralityof optical channels along the line extension direction of thesingle-line array in a translatory manner, which is further controlledby the optical image stabilization control of the multi-aperture imagingdevice such that, by moving the optics of the plurality of opticalchannels along the line extension direction of the single-line array ina translatory manner, image stabilization is effected along a firstimage axis and, by generating the rotary movement of the beam-deflectingdevice, image stabilization is effected along a second image axis.